Front End Processing
High Temperature RTP
Silicon Carbide implantation annealing
Graphene by high temperature SiC sublimation
CVD of graphene
DLI-CVD / DLI-ALD
Simple & multi-metallic oxides
Metals, nitrides and alloys
III-V, wide band gap semiconductors
Nanotubes and nanowires
2-inch Spray CVD
2-inch SprayCVD furnace for laboratories.
Aerosol CVD processes
Deposition and annealing in the same chamber
Deposited films are typically below one micron, in nanometer range. By glow discharge between two polarised electrodes.
Applications: Decoration, Defense, Energy, Solar cell, Medical, Microelectronics, Optic.
YES manufactures a wide variety of processing equipment including tools to assist MEMS device manufacturers with proper curing, surface tension modification, getter activation, metal annealing, and wafer dehydration.
IN Addition YES manufactures the following equipment: VertaCure automated, high temperature cure oven ideal for polymer and BCB cure.
BCB Cure - used to create photosensitive polymers, which require fewer processing steps than dry etch materials.
Typical plasma cleaning applications include:
Back End processing
Die Bond & Dispense
MRSI’s current product portfolio consists of configurable die bonding and epoxy dispensing tools
catering to the precision end of the electronics assembly market.
Capable of placement accuracies ranging from 3 micron (“μm”) to 10µm.
RF & Microwave Assembly
Manufacturers of microwave modules, RF circuits, MEMS, advanced semiconductor packages,
multi-chip modules, hybrid devices are the original “core” customers for the MRSI products.
Eutectic Die Bonding
The term “eutectic” is from the Greek word eutektos, meaning “easily melted.
” It is defined as the temperature and percent mixture (point “E” on Figure 2)
where it will go directly from pure solid to pure liquid, just like a pure metal would.
Any point on the phase diagram above the line “AEB” is above the eutectic
temperature and is referred to as the “liquidus”
state, i.e., where the mixture is 100 percent liquid.1
Microwave and RF Packages such as RF power amplifiers, RF-SOE power transmitters, microwave transmitter and receivers typically transmit at high frequency and generate high power.
The automated systems are driven by MicroXact's XactTest ™ software developed in-house and refined through collaboration with customers. The Interface is designed to be simple yet powerful, allowing users to easily set up an automated testing procedure for nearly any kind of device. The LabView-based software is logically structured and allows for easy integration of the customer's own test and measurement equipment
Automated Resistivity Mapping System (A4P)
MicroXact team works diligently with customers to develop the best possible automation solutions as quickly as possible.